| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device capable of reducing size in a thickness direction of the electronic device, where first and second semiconductor devices are laminated, and improving electrical connection reliability between the first and second semiconductor devices, and to provide a method of manufacturing the electronic device. <P>SOLUTION: In the electronic device, a second semiconductor device 12 is stuck onto a first semiconductor device 11 by an adhesive layer 13, through-holes 15-17 penetrating an adhesive layer 13 at a part positioned between through-holes 146-148 provided in the second semiconductor device 12 and second connection surfaces 31A, 32A, 33A of through electrodes 31-33 provided in the first semiconductor device 11 are formed, and through electrodes 21-23 filling the through-holes 15-17, 146-148 and connected to the second connection surfaces 31A, 32A, 33A of the through electrodes 31-33 and the through electrodes 106-108 are provided. <P>COPYRIGHT: (C)2011,JPO&INPIT |
