| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can fully maintain the heat dissipation of a plurality of switching elements, while maintaining insulation between the plurality of switching elements, and to provide a radiating body which is used for the device. <P>SOLUTION: In a semicondutor device 1, a first switching element 11 and a second switching element 12 are mounted on a die pad 2. The first switching element 11 is bonded directly with the die pad 2, while the second switching element 12 is mounted on the die pad 2 through a radiating body 5. The radiating body 5 is constituted mainly of a silicon substrate 51 which excels in heat dissipation. <P>COPYRIGHT: (C)2011,JPO&INPIT |
