| 摘要 |
<P>PROBLEM TO BE SOLVED: To secure insulation between a transmission-side first circuit and a reception-side second circuit while correctly transmitting a signal when connecting an interconnection substrate to the transmission-side first circuit and the interconnection substrate to the reception-side second circuit by a pair of inductors. <P>SOLUTION: An interconnection substrate 60 is mounted over a first inductor 302 of a semiconductor chip 10 and a second inductor 322 of a semiconductor chip 20. The interconnection substrate 60 includes a third inductor 304 and a fourth inductor 324. The third inductor 304 is located above the first inductor 302. The distance from the first inductor 302 to the third inductor 304 is larger than the distance from the second inductor 322 to the fourth inductor 324. <P>COPYRIGHT: (C)2011,JPO&INPIT |
