发明名称 COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD FOR PRODUCING METAL PATTERN MATERIAL, AND NEW POLYMER
摘要 <P>PROBLEM TO BE SOLVED: To provide a composition for forming a layer to be plated, which is developable with an aqueous solution and with which a layer to be plated excellent in adsorptivity to a plating catalyst or a precursor thereof is formed, to provide a method of producing a metal pattern material, by which a metal pattern excellent in adhesion with a substrate is easily formed by using development with an aqueous solution; and to provide a new polymer useful for the composition for forming a layer to be plated. <P>SOLUTION: The composition for forming a layer to be plated includes a polymer having a non-dissociative functional group that interacts with a plating catalyst or a precursor thereof, a radical polymerizable group, and an ionic polar group. The method of producing a metal pattern material uses the composition for forming a layer to be plated. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010248464(A) 申请公布日期 2010.11.04
申请号 JP20090223220 申请日期 2009.09.28
申请人 FUJIFILM CORP 发明人 KANO TAKEYOSHI;SATO MASATAKA;KONO TAKATSUGU
分类号 C08F220/00;C08F290/00;G03F7/038;G03F7/11;G03F7/40;H05K3/18 主分类号 C08F220/00
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