发明名称 THERMALLY CONDUCTIVE ADHESIVE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electrically insulating thermally conductive adhesive having excellent thermal conductivity and excellent bonding property with respect to a heat generating member and a heat radiating member. <P>SOLUTION: The thermally conductive adhesive includes 100 pts.mass of (A) a polyimide silicone resin of a 5,000-150,000 weight average molecular weight having a repeating unit represented by formula (1), 100 to 10,000 pts.mass of (B) an electrically insulating thermally conductive filler, and (C) an organic solvent. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010248349(A) 申请公布日期 2010.11.04
申请号 JP20090098430 申请日期 2009.04.14
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 YONEDA YOSHIAKI;SUGAO MICHIHIRO
分类号 C09J183/10;C08G73/10;C09J11/04;C09J11/06;C09J11/08;C09J179/08 主分类号 C09J183/10
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