发明名称 |
WIRING BOARD, WIRING BOARD ASSEMBLY, AND METHODS OF MANUFACTURING THE WIRING BOARD AND THE WIRING BOARD ASSEMBLY |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and an assembly of the wiring board, capable of suppressing formation of gas reservoirs at the bottom of a via hole without causing any large-scale investment in facilities. SOLUTION: The wiring board includes a groove 6 for allowing the via hole 4 to communicate with the outside within a range of a land 5, where the groove guides gas residing in the via hole 4 to the outside of the via hole 4 when filling a conductor. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010251618(A) |
申请公布日期 |
2010.11.04 |
申请号 |
JP20090101383 |
申请日期 |
2009.04.17 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
KASUGA TAKASHI;OKA YOSHIO |
分类号 |
H05K3/46;H05K1/11;H05K3/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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