发明名称 WIRING BOARD, WIRING BOARD ASSEMBLY, AND METHODS OF MANUFACTURING THE WIRING BOARD AND THE WIRING BOARD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a wiring board and an assembly of the wiring board, capable of suppressing formation of gas reservoirs at the bottom of a via hole without causing any large-scale investment in facilities. SOLUTION: The wiring board includes a groove 6 for allowing the via hole 4 to communicate with the outside within a range of a land 5, where the groove guides gas residing in the via hole 4 to the outside of the via hole 4 when filling a conductor. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010251618(A) 申请公布日期 2010.11.04
申请号 JP20090101383 申请日期 2009.04.17
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KASUGA TAKASHI;OKA YOSHIO
分类号 H05K3/46;H05K1/11;H05K3/00 主分类号 H05K3/46
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