发明名称 |
Rauscharme Flip-Chip-Verpackungen und Flip-Chips dafür |
摘要 |
A low-noise flip-chip package, comprising: a carrier substrate having first and second opposing main faces; and a flip-chip substrate connected in a face-down manner onto the first main face of the carrier substrate via a connection array, wherein: the flip-chip substrate comprises at least first and second circuitry portions spaced apart from one another; the flip-chip substrate comprises a substrate-contact boundary located between the first and second circuitry portions; and each of the first circuitry portion, the second circuitry portion and the substrate-contact boundary has its own separate signal-reference connection extending via a respective connection of the connection array through the carrier substrate to a respective electrical contact at the second main face of the carrier substrate for connection to a common signal-reference element in an external circuit. |
申请公布号 |
DE602007009375(D1) |
申请公布日期 |
2010.11.04 |
申请号 |
DE20076009375T |
申请日期 |
2007.07.27 |
申请人 |
FUJITSU SEMICONDUCTOR LTD. |
发明人 |
DEDIC, IAN JUSO;ALI, GHAZANFER |
分类号 |
H01L23/498;H01L23/50;H01L23/552 |
主分类号 |
H01L23/498 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|