发明名称 PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment device in which plasma treatment can be applied efficiently while preventing the generation of abnormal discharge to a work. <P>SOLUTION: The plasma treatment device 1 has an electrode unit 2 installed above the work 10, an energizing means 3, a treatment gas supply means 4, and a cooling means 5. The electrode unit 2 has an earth electrode 21 equipped with the electrode body 211 constituted of a longitudinal columnar body and a through-hole 212 installed along a longitudinal direction in the electrode body 211, and an applying electrode 22 equipped with an electrode rod 221 inserted through the through-hole 212. A gap is formed between the through-hole 212 and the electrode rod 221, and the gap functions as a plasma forming space 27. Moreover, a slit 28 to open the plasma forming space 27 to the outside is formed in the earth electrode 21. By ejecting plasma P from the slit 28, the plasma treatment is applied to the work 10. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010251162(A) 申请公布日期 2010.11.04
申请号 JP20090100386 申请日期 2009.04.16
申请人 SEIKO EPSON CORP 发明人 UEDA SHINICHI
分类号 H05H1/24;B08B5/00;C23C16/509 主分类号 H05H1/24
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