发明名称 |
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate and a semiconductor device that easily obtain desired electrical characteristics and a method of manufacturing the semiconductor substrate. SOLUTION: The method of manufacturing a semiconductor substrate includes: a first epitaxial layer forming process S1 that forms a first epitaxial layer; a trench forming process S2 that forms a trench in the first epitaxial layer; and epitaxial layer forming processes S3, S4, and S5 that form an epitaxial layer in the first epitaxial layer and the trench using two or more growth conditions including different growth speeds so as to fill in the trench and make a dopant concentration taken into the epitaxial layer under each two or more growth conditions constant. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010251737(A) |
申请公布日期 |
2010.11.04 |
申请号 |
JP20100071059 |
申请日期 |
2010.03.25 |
申请人 |
SUMCO CORP;DENSO CORP |
发明人 |
NOGAMI SHOJI;GOTO JIN;SHIBATA TAKUMI;YAMAMOTO TAKESHI |
分类号 |
H01L21/336;H01L21/20;H01L21/205;H01L29/06;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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