SUPERIMPOSING APPARATUS FOR SUPERIMPOSING MULTIPLE SUBSTRATES AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To achieve a superimposing apparatus capable of correctly moving another wafer onto one wafer at high speed in accordance with an aligning command because such the apparatus is especially sought, in view of the fact that it becomes difficult to align wafers at high speed in the accuracy of submicron in the entire surface to be superimposed in recent years with the tendency of an increase in the diameter of each wafer. SOLUTION: The superimposing apparatus for superimposing a plurality of wafers includes: a first stage for holding one wafer; a second stage for holding another wafer and superimposing the other wafer over the one wafer held in the first stage by being approximated to the first stage; and a position measuring section for measuring the position of the second stage while using the first stage as a datum of aligning. COPYRIGHT: (C)2011,JPO&INPIT