| 摘要 |
PROBLEM TO BE SOLVED: To form a laminated wiring pattern without causing interlaminar delamination of insulating layers, even forming a thick wiring pattern, when forming a laminated wiring pattern comprising a plurality of wiring patterns respectively laminated via the insulating layer. SOLUTION: As a photosensitive insulating paste for forming an insulating layer, it is configured to use a photosensitive insulating paste in which the content of an optical absorbing agent is adjusted so as to obtain an exposure amount which is more than or equal to an amount required for photocuring the whole area in a thickness direction of a photosensitive insulating paste film 12. A wiring pattern is formed by the optical imprint method or the photolithography method. A through-hole for a via hole is formed by the photolithographic method, before curing the photosensitive insulating paste film, and the exposure amount during processing by the photolithography method is set to an exposure amount, such that the diameter of the through-hole for a via hole to be formed is≥50% of the diameter of a light-shielding area for forming the through-hole for a via hole of a photomask. COPYRIGHT: (C)2011,JPO&INPIT |
