发明名称 RADIATOR AND ELECTRIC APPLIANCE
摘要 PROBLEM TO BE SOLVED: To provide a radiator having a plated layer thereon which is formed by coating a surface of an aluminum member with Zn, Ni and Sn and has further improved wettability of solder. SOLUTION: The radiator 11 has the improved wettability of solder due to the plated layer formed thereon by coating the surface of the aluminum member with Zn, Ni and Sn, wherein the plated layer is formed so that a Zn weight ratio occupying in the whole weight is controlled to 0.16-0.24%, an Ni weight ratio occupying in the whole weight is controlled to 2.72-2.94%, and an Sn weight ratio occupying in the whole weight is controlled to 0.43-0.50%, and the plated layer is further coated with a urethane resin so that the weight ratio of the urethane resin occupying in the whole weight is controlled to 0.02-0.08%. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010248554(A) 申请公布日期 2010.11.04
申请号 JP20090097819 申请日期 2009.04.14
申请人 ARAI TOSHIYUKI 发明人 ARAI TOSHIYUKI
分类号 C23C28/00;H01L23/36;H01L23/467;H01T23/00;H05K7/20 主分类号 C23C28/00
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