| 摘要 |
A thin board container is composed of a tray storing body for stacking a plurality of placing trays which can be removed from each other, and storing semiconductor wafers by sandwiching the semiconductor wafers in spaces between the placing trays; and an external container for storing the tray storing body inside. At the both facing side ends of each placing tray, a pair of holding sections wherein the processing arms of an external mechanical device fit for holding the tray are arranged. The external container is provided with a container main body; a cover body; and a sealing material arranged between the cover body and the container main body for sealing the inside; a pair of tray storing body supporting sections for supporting the tray storing body; and a tray storing body holder for supporting the tray storing body stored in the container main body by holding the tray storing body from the bottom surface side and the cover body side.
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