| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device which has an excellent heat dissipation property and enhances an optical output. <P>SOLUTION: This light-emitting device 20 has: a semiconductor light-emitting element 1 which is formed on the one surface side of a zinc oxide substrate 1a, and is provided with an LED thin film part 1b having a p-type nitride semiconductor layer 11 and an n-type nitride semiconductor layer 13; and a packaging substrate 2 for packaging the semiconductor light-emitting element 1 through metal bumps 3 and 4 so that the other surface side in the zinc oxide substrate 1a of the semiconductor light-emitting element 1 becomes a light fetching face. The semiconductor light-emitting element 1 is provided with the LED thin film part 1b smaller than the zinc oxide substrate 1a so as to expose an outer peripheral part 1d on the one surface side of the zinc oxide substrate 1a in plan view, and the metal bumps 3 and 4 include: a plurality of first metal bumps 3 provided in the outer peripheral part 1d of the zinc oxide substrate 1a so as to surround the LED thin film part 1b; and a plurality of second metal bumps 4 provided on the surface side opposite to the zinc oxide substrate 1a in the LED thin film part 1b. <P>COPYRIGHT: (C)2011,JPO&INPIT |
