| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sealing method for enhancing adhesive strength between a package material and a substrate. <P>SOLUTION: The invention relates to the sealing method for enhancing the adhesive strength between a package material 302 and substrate 102. The sealing method includes a step of forming at least one fixed hole in one surface of the substrate, a step of coating an inner peripheral surface of the at least one fixed hole with a bonding material for bonding to the package material, and a step of putting the package material in the fixed hole. The package material and the bonding material in the fixed hole are bonded together, so the adhesive strength between the package material and substrate can be enhanced. <P>COPYRIGHT: (C)2011,JPO&INPIT |
