| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photocurable and/or thermosetting composition which is excellent in developability and is capable of yielding an excellent cured film fully satisfying characteristics, such as hardness, soldering heat resistance, chemical resistance, adhesion, PCT resistance, electroless gold plating resistance, whitening resistance, electrical insulating properties, and flexibility; and to provide a cured product thereof. <P>SOLUTION: The curable composition contains: (A) a carboxyl group containing-compound with an acid value of 30-200 mgKOH/g obtained when 1 equivalent weight of epoxy groups of a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.9 mol of a monocarboxylic acid (b), 1 equivalent weight of epoxy groups of the resulted reaction product (c) is made to react with 0.2-5.0 moles of a polybasic acid anhydride (e) in the presence of 0.1-5.0 moles of water (d), and further, 1 equivalent weight of epoxy groups of the resulted reaction product (f) is made to react with 0.0-5.0 moles of a monocarboxylic acid (g); (B) a photosensitive (meth)acrylate compound; and (C) a photoinitiator. <P>COPYRIGHT: (C)2011,JPO&INPIT |
