发明名称 WIRING BOARD, WIRING BOARD ASSEMBLY, AND METHOD OF MANUFACTURING THE WIRING BOARD AND THE WIRING BOARD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a wiring board and an assembly of the wiring board, capable of suppressing electrical connection of a conductor overflowing from a via hole and wiring around the via hole without increasing the size of a land. SOLUTION: The wiring board includes a groove 6 formed to capture a conductor overflowing to the periphery of the via hole 4 when filling the conductor and to surround the via hole 4 within a range of a land 5. The groove 6 is formed to surround the via hole 4, thus capturing the conductor by the groove 6 and suppressing spread to the outside of the groove even if the conductor overflows in filling of the conductor into the via hole when conductive paste, namely a conductor, is pushed into the via hole 4. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010251619(A) 申请公布日期 2010.11.04
申请号 JP20090101384 申请日期 2009.04.17
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KASUGA TAKASHI;OKA YOSHIO
分类号 H05K1/11;H05K1/02;H05K3/00;H05K3/34;H05K3/46 主分类号 H05K1/11
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