发明名称 |
WIRING BOARD, WIRING BOARD ASSEMBLY, AND METHOD OF MANUFACTURING THE WIRING BOARD AND THE WIRING BOARD ASSEMBLY |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and an assembly of the wiring board, capable of suppressing electrical connection of a conductor overflowing from a via hole and wiring around the via hole without increasing the size of a land. SOLUTION: The wiring board includes a groove 6 formed to capture a conductor overflowing to the periphery of the via hole 4 when filling the conductor and to surround the via hole 4 within a range of a land 5. The groove 6 is formed to surround the via hole 4, thus capturing the conductor by the groove 6 and suppressing spread to the outside of the groove even if the conductor overflows in filling of the conductor into the via hole when conductive paste, namely a conductor, is pushed into the via hole 4. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010251619(A) |
申请公布日期 |
2010.11.04 |
申请号 |
JP20090101384 |
申请日期 |
2009.04.17 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
KASUGA TAKASHI;OKA YOSHIO |
分类号 |
H05K1/11;H05K1/02;H05K3/00;H05K3/34;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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