| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate bonding device with little power consumption, which reduces tact time, and flexibly deals with frames of different shapes on the same substrate. SOLUTION: The substrate bonding device for bonding substrates W by irradiating light to sealing agent applied between substrates W which have translucency, includes a moving carrier 5 which is movable in a first direction X. The moving carrier 5 includes: first linear light sources 8 and 9, which are arranged side by side along the first direction, and movable to a second direction Y orthogonal to the first direction; and a second linear light source 12 which is arranged along the second direction Y, and movable in the second direction Y. The sealing agent applied along the first direction X is irradiated with light by the first linear light sources 8 and 9, while moving the moving carrier 5, and the moving carrier 5 is stopped, and the sealing agent applied along the second direction Y is irradiated with light, while moving the second linear light source 12. COPYRIGHT: (C)2011,JPO&INPIT
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