| 摘要 |
PROBLEM TO BE SOLVED: To improve accuracy in detecting the progressive breakage of wires and short-circuit failures. SOLUTION: A wiring failure inspection apparatus 1 for inspecting failures of an inter-chip wire connecting at least two chips to each other is provided with: an inspection current path determination part 2 for determining a path through which an inspection current is made to flow to an inter-chip wire to be inspected according to the type of inspection; a power source voltage determination part 3 for determining an optimal power source voltage for generating the inspection current; and a buffer output control part 4 for making different the output of a buffer connecting to a target inter-chip wire to be inspected and the output of a buffer connecting to an non-target inter-chip wire not to be inspected. COPYRIGHT: (C)2011,JPO&INPIT
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