发明名称 Heat Sink for a RAM
摘要 A heat sink for a RAM includes a first and a second heat dissipating plate, on each of which a retaining tongue, a pair of locating tabs, and a catch tab are provided. The retaining tongue includes an expanded head portion and a narrowed root portion, and the head portion is a tab having a specific shape. The catch tab is provided with an expanded through retaining hole and a narrowed through root hole, which are configured to match the shape of the heat portion and the root portion of the retaining tongue, respectively. When the two heat dissipating plates are connected to each other, once the head portions and root portions of the retaining tongues are extended through the corresponding retaining holes and root holes of the catch tabs, the retaining tongues will not unexpectedly separate from the catch tabs.
申请公布号 US2010276134(A1) 申请公布日期 2010.11.04
申请号 US20090432046 申请日期 2009.04.29
申请人 LEE WEN-YI 发明人 LEE WEN-YI
分类号 F28F7/00 主分类号 F28F7/00
代理机构 代理人
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