发明名称 |
Bearbeitungsverfahren und Bearbeitungsvorrichtung, die interferierende Laserstrahlen verwenden, sowie Beugungsgitter und Miktrostruktur, hergestellt mit dem Barbeiungsverfahren |
摘要 |
<p>Provided are a processing method and a processing apparatus which are capable of suppressing a disturbance attributable to a surface wave in a processing by interfered laser beams, in particular, a processing by the interfered laser beams of a pulsed laser having a pulse width of equal to or more than 1 fs and of equal to or less than 1 ps, in which the wavelength of a surface wave that propagates in a direction of the interference of the laser is made longer than a pitch of the interference of the laser on a surface of an object to be processed to process the object.</p> |
申请公布号 |
DE112006001230(B4) |
申请公布日期 |
2010.11.04 |
申请号 |
DE20061101230T |
申请日期 |
2006.05.18 |
申请人 |
CANON K.K. |
发明人 |
IWASE, HIDEO |
分类号 |
B23K26/36;B23K26/06;G02B1/11;G02B5/18 |
主分类号 |
B23K26/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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