发明名称 Bearbeitungsverfahren und Bearbeitungsvorrichtung, die interferierende Laserstrahlen verwenden, sowie Beugungsgitter und Miktrostruktur, hergestellt mit dem Barbeiungsverfahren
摘要 <p>Provided are a processing method and a processing apparatus which are capable of suppressing a disturbance attributable to a surface wave in a processing by interfered laser beams, in particular, a processing by the interfered laser beams of a pulsed laser having a pulse width of equal to or more than 1 fs and of equal to or less than 1 ps, in which the wavelength of a surface wave that propagates in a direction of the interference of the laser is made longer than a pitch of the interference of the laser on a surface of an object to be processed to process the object.</p>
申请公布号 DE112006001230(B4) 申请公布日期 2010.11.04
申请号 DE20061101230T 申请日期 2006.05.18
申请人 CANON K.K. 发明人 IWASE, HIDEO
分类号 B23K26/36;B23K26/06;G02B1/11;G02B5/18 主分类号 B23K26/36
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