TRENCH SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a trench substrate that reduces a plating deviation, and a method of manufacturing the trench substrate. SOLUTION: The trench substrate includes a base substrate 102; an insulating layer 112 formed on one or both surfaces of the base substrate 102 and having a circuit region therein and having a trench formed in a dummy region of a product edge; and a circuit layer 124 including a circuit pattern and a via formed in the interior of the trench formed in the circuit region by a plating step. Trenches are formed in the dummy region of the product edge and in a cutting region between products to improve a plating deviation, thereby improving a deviation between plating layers formed on the insulating layer in a plating step. COPYRIGHT: (C)2011,JPO&INPIT