发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD
摘要 A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
申请公布号 US2010279229(A1) 申请公布日期 2010.11.04
申请号 US20100838025 申请日期 2010.07.16
申请人 MIYASAKA MASAHIRO;KUMAKI TAKASHI 发明人 MIYASAKA MASAHIRO;KUMAKI TAKASHI
分类号 G03F7/20;G03F7/004 主分类号 G03F7/20
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