EXPOSURE METHOD, EXPOSURE DEVICE, RETICLE, AND DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an exposure method that improves the yield of a product.

SOLUTION: The exposure method of exposing a wafer to a device pattern of a reticle includes the steps of: arranging the reticle at a first angle and measuring first flatness of the reticle; arranging the reticle at a second angle and measuring second flatness of the reticle; and determining a setting angle of the reticle during exposure based upon measurement results of the first flatness and second flatness.

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