| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate structure that is improved in bonding strength over the entire interface between a bump and UBM. <P>SOLUTION: The substrate structure includes a semiconductor substrate 15, an electrode 14 formed on the semiconductor substrate 15, and an under-barrier metal layer 12 formed on the electrode 14. The under-barrier metal layer 12 has a plurality of fine recessed portions 12a. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
