| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an aqueous dispersant for chemical mechanical polishing, a method for preparing a relevant dispersant, and a chemical mechanical polishing method of a semiconductor device, which performs polishing without causing defects in a copper film and in an insulating film, while enabling high polishing speed and high planarization property to be compatible without copper remainder (copper residue) and corrosion. <P>SOLUTION: The aqueous dispersant is used for chemical mechanical polishing for polishing a film composed of copper or copper alloy containing (A) amino acids, (B) compounds having a triazole frame, (C) compounds having a pyridine frame, (D) oxidants, and (E) abrasive grains, wherein the mass ratio (W<SB>C</SB>/W<SB>B</SB>) of the content (W<SB>B</SB>) of the component (B) and the content (W<SB>C</SB>) of the component (C) is 30-100, and the pH is 6-8. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
