| 摘要 |
PROBLEM TO BE SOLVED: To provide an impedance-controlled wiring board equipped having interconnect lines whose impedance is controlled, and to provide a method of manufacturing the same, with the impedance of the interconnect lines being controlled properly. SOLUTION: The impedance-controlled wiring board is equipped with an insulating layer, a first and a second wiring patterns which contain impedance-controlled interconnect lines and are provided on both the surfaces of the insulating layer so as not to recede in the thickness direction of the insulating layer, an interlayer connector which is pinched between the surfaces of the first and second wiring patterns penetrating through the insulating layer, and a second insulating layer that is laminated at least on the side of the former insulating layer which faces the first or second wiring pattern. Conductor bumps are formed on a first metal foil, an insulating layer is laminated on the first metal foil so as to make the conductor bumps penetrate through it, a second metal foil is laminated on the laminated insulating layer in one piece so as to establish electrical connection with the heads of the conductor bumps penetrating through the insulating layer, and the first and second metal foils provided on the insulating layer are subjected to patterning and the impedance-controlled interconnect lines are formed. COPYRIGHT: (C)2006,JPO&NCIPI |
