发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT UTILIZING THE COMPOSITION, METHOD FOR FORMATION OF RESIST PATTERN, AND PROCESS FOR PRODUCTION OF PRINTED CIRCUIT BOARD
摘要 <p>Disclosed is a photosensitive resin composition comprising a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and at least one pyrazine compound selected from the group consisting of compounds each having a structure represented by formula (1), compounds each having a structure represented by formula (2) and compounds each having a structure represented by formula (3). [In formulae (1) to (3), R1 to R12 independently represent a univalent organic group containing an alkyl group, a cycloalkyl group, a phenyl group, a naphthyl group or a heterocyclic group, wherein R1 and R2, R3 and R4, R5 and R6, R7 and R8, R9 and R10, or R11 and R12 may be bound to each other and, together with two carbon atoms contained in a pyrazine skeleton, form a ring. In formula (2), X and Y independently represent an atom group that constitutes an aromatic ring formed together with two carbon atoms contained in a pyrazine skeleton and having a monocyclic or condensed polycyclic structure. In formula (3), Z represents an atom group that constitutes an aromatic ring having a monocyclic or condensed polycyclic structure and formed together with four carbon atoms contained in a pyrazine skeleton or a hetero ring.</p>
申请公布号 WO2010126006(A1) 申请公布日期 2010.11.04
申请号 WO2010JP57367 申请日期 2010.04.26
申请人 HITACHI CHEMICAL COMPANY, LTD.;SHANGHAI JIAO TONG UNIVERSITY;MIYASAKA MASAHIRO;KAJI MAKOTO;YIN JIE;JIANG XUESONG;SUN LIDA 发明人 MIYASAKA MASAHIRO;KAJI MAKOTO;YIN JIE;JIANG XUESONG;SUN LIDA
分类号 G03F7/031;C07D241/42;C08F2/50;C08F220/06;G03F7/004;G03F7/033;H05K3/00 主分类号 G03F7/031
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