| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent breakage of a metallic ribbon while ensuring the bonding strength even when the metallic ribbon becomes thin associated with a reduction in size of a semiconductor chip in manufacturing of a semiconductor device involving a step of bonding the metallic ribbon to a pad of the semiconductor chip. <P>SOLUTION: In bonding an Al ribbon, positioned on the surface of a pad of a semiconductor chip, by bringing a pressure bonding surface of a wedge tool 10 into pressure contact with the Al ribbon while applying ultrasonic vibration to the Al ribbon, recesses 10a are provided at both ends of the pressure bonding surface of the wedge tool 10 so as to prevent both ends in the width direction of the Al ribbon, bonded to the pad, from contacting with the pressure bonding surface of the wedge tool 10. <P>COPYRIGHT: (C)2011,JPO&INPIT |
