| 摘要 |
PROBLEM TO BE SOLVED: To achieve electric inspection of a semiconductor integrated circuit device having a test pad with narrowed pitches. SOLUTION: A semiconductor wafer partitioned into a plurality of chip domains in which a semiconductor integrated circuit is formed respectively, and having a plurality of electrodes connected electrically to the semiconductor integrated circuit and formed on a main surface, is prepared, and tips of a plurality of contact terminals are brought into contact with the plurality of electrodes by using a probe card having the plurality of contact terminals contactable with the plurality of electrodes. The probe card includes a first sheet (2) including the contact terminals and second wiring electrically connected thereto, and a second sheet (45) by an invar is arranged on the back surface of a domain therein where the contact terminals are formed. On the second sheet, a first elastomer is provided penetratingly through the second sheet on a formation position of the contact terminals, and a second elastomer is provided penetratingly through the second sheet on a position in the periphery of the first elastomer. A domain where the contact terminals are formed on the first sheet is pressed from the back surface through the second sheet, to thereby bring the tips of the contact terminals into contact with the electrodes. COPYRIGHT: (C)2011,JPO&INPIT
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