发明名称 |
POLYAMIDE RESIN COMPOSITION AND MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition and a molding excellent in shock resistance as well as rigidity and dimensional stability when absorbing water, and excellent in molding property. SOLUTION: The polyamide resin composition contains (A) a copolyamide resin comprising 70 to 85 mass% of a hexamethylene adipamide unit (N66) and 15 to 30 mass% of a hexamethylene isophthalamide unit (N6I) and a caproamide unit (N6) in a compounding mass ratio (N6I/M6) of 1.0 or more; (B) an aliphatic polyamide resin obtained from an aminocarboxylic acid and/or a combination of diamine and a dicarboxylic acid, in which a ratio (C/N) of the number of carbon atoms to nitrogen atoms ranges from 7 to 12 and relative viscosity in accordance with JIS K6810 ranges from 2.0 to 2.5; and (C) a glass fiber. The weight ratio (A/B) ranges from 40/60 to 60/40; and the component (C) is included by 20 to 250 parts by mass with respect to total 100 parts by mass of the component (A) and component (B). COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010248403(A) |
申请公布日期 |
2010.11.04 |
申请号 |
JP20090100680 |
申请日期 |
2009.04.17 |
申请人 |
ASAHI KASEI CHEMICALS CORP |
发明人 |
SAKATA NORIO;ISEYA TETSUO |
分类号 |
C08L77/00;C08G69/02;C08K3/30;C08K7/04 |
主分类号 |
C08L77/00 |
代理机构 |
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代理人 |
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主权项 |
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