发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition and a molding excellent in shock resistance as well as rigidity and dimensional stability when absorbing water, and excellent in molding property. SOLUTION: The polyamide resin composition contains (A) a copolyamide resin comprising 70 to 85 mass% of a hexamethylene adipamide unit (N66) and 15 to 30 mass% of a hexamethylene isophthalamide unit (N6I) and a caproamide unit (N6) in a compounding mass ratio (N6I/M6) of 1.0 or more; (B) an aliphatic polyamide resin obtained from an aminocarboxylic acid and/or a combination of diamine and a dicarboxylic acid, in which a ratio (C/N) of the number of carbon atoms to nitrogen atoms ranges from 7 to 12 and relative viscosity in accordance with JIS K6810 ranges from 2.0 to 2.5; and (C) a glass fiber. The weight ratio (A/B) ranges from 40/60 to 60/40; and the component (C) is included by 20 to 250 parts by mass with respect to total 100 parts by mass of the component (A) and component (B). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010248403(A) 申请公布日期 2010.11.04
申请号 JP20090100680 申请日期 2009.04.17
申请人 ASAHI KASEI CHEMICALS CORP 发明人 SAKATA NORIO;ISEYA TETSUO
分类号 C08L77/00;C08G69/02;C08K3/30;C08K7/04 主分类号 C08L77/00
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