METHODS OF EMBEDDING THIN-FILM CAPACITORS INTO SEMICONDUCTOR PACKAGES USING TEMPORARY CARRIER LAYERS
摘要
Disclosed are methods of making a semiconductor package comprising at least one thin-film capacitor embedded into at least one build-up layer of said semiconductor package. A thin-film capacitor is provided wherein the thin-film capacitor has a first electrode and a second electrode separated by a dielectric. A temporary carrier layer is applied to the first electrode and the second electrode is patterned. A PWB core and a build-up material are provided, and the build-up material is placed between the PWB core and the patterned second electrode of said thin-film capacitor. The patterned electrode side of the thin-film capacitor is laminated to the PWB core by way of the build-up material, the temporary carrier layer is removed, and the first electrode is patterned.
申请公布号
WO2010126957(A1)
申请公布日期
2010.11.04
申请号
WO2010US32694
申请日期
2010.04.28
申请人
E.I. DU PONT DE NEMOURS AND COMPANY;DELLIS, LYNNE, E.;DIETZ, KARL, H.;MCGREGOR, DAVID, ROSS
发明人
DELLIS, LYNNE, E.;DIETZ, KARL, H.;MCGREGOR, DAVID, ROSS