发明名称 |
Coupled resonator device, method for manufacturing a coupled resonator device and wafer compound |
摘要 |
<p>A method for manufacturing a coupled resonator device includes forming a first BAW-device on a first substrate, forming a second BAW-device on a second substrate, and bonding the first and the second BAW-device such that the bonded first and second BAW-device are sandwiched between the first and second substrate.</p> |
申请公布号 |
GB2459549(B) |
申请公布日期 |
2010.11.03 |
申请号 |
GB20090003443 |
申请日期 |
2009.02.27 |
申请人 |
AVAGO TECHNOLOGIES WIRELESS IP |
发明人 |
MARTIN HANDTMANN;KLAUS-GUENTER OPPERMANN;MARTIN FRITZ |
分类号 |
H03H9/205;H03H3/02;H03H9/58 |
主分类号 |
H03H9/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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