发明名称 |
OPTICAL INTERCONNECTION DEVICE |
摘要 |
Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules (12) are arranged on a periphery of an LSI (11) electrically connected to an electric wiring board (10), and liquid cooling mechanisms (13, 14) are respectively placed on the LSI (11) and the optical modules (12). The plurality of optical modules (12) may be arranged only on a surface of the electric wiring board (10) where the LSI (11) is mounted, only on a surface opposite to the surface where the LSI (11) is mounted, or on both the same surface as and the opposite surface to the surface where the LSI (11) is mounted. |
申请公布号 |
EP2246945(A1) |
申请公布日期 |
2010.11.03 |
申请号 |
EP20090711632 |
申请日期 |
2009.02.16 |
申请人 |
NEC CORPORATION |
发明人 |
ODA, MIKIO;ISHIDA, TOMOTAKA;TAKAHASHI, HISAYA;ONO, HIDEYUKI;SAKAI, JUN;OHTSUKA, TAKASHI;NODA, ARIHIDE;KOUTA, HIKARU |
分类号 |
H01S5/024;G02B6/42;H01L25/16;H01L31/12;H05K7/20 |
主分类号 |
H01S5/024 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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