BGA PACKAGE SUBSTRATE AND TEST IT USING BGA PACKAGE TESTING METHODS

摘要

PURPOSE: A substrate for a BGA(Ball Grid Array) package test and a BGA package testing method using the same are provided to smoothly test a degradation rate of a BGA package. CONSTITUTION: A substrate(100) is installed between a connection socket(20) and a BGA package(30) to test the BGA package. The substrate is used for testing the defective rate of the BGA package through a surface contact between a connection terminal(22) of the connection socket and a ball type connection terminal(32) of the BGA package.