发明名称 |
System for cleaning a wafer |
摘要 |
A system for cleaning a wafer. At least one first chuck roller is connected to a first roller base and includes a first annular groove. A second roller base opposes the first roller base. At least one second chuck roller is connected to the second roller base and includes a second annular groove. A sensing chuck roller is connected to the second roller base and includes a third annular groove corresponding to the first and second annular grooves. A cleaning member covers the third annular groove. A circumferential edge of the wafer is positioned in the first and second annular grooves and abuts the cleaning member. The first and second chuck rollers rotate the wafer, enabling the circumferential edge thereof to rub against the cleaning member.
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申请公布号 |
US7823241(B2) |
申请公布日期 |
2010.11.02 |
申请号 |
US20070723900 |
申请日期 |
2007.03.22 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HU TIEN-CHEN;HSIEH CHIH-MING;LAI CHIEN-CHANG;LEE WEN-JIN;CHEN DA-HSIANG |
分类号 |
B08B11/00 |
主分类号 |
B08B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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