发明名称 Semiconductor device and method of manufacturing semiconductor device
摘要 In a semiconductor device 100, a light emitting device 102 is mounted on a substrate 101. A light reflection preventing film 130 for preventing a reflection of a light is formed on an upper surface of the light emitting device 102. Moreover, a plate-shaped cover 103 formed of a glass having a light transparency is disposed above the light emitting device 102, and a light reflection preventing film 140 for preventing a reflection of a light is also formed on an upper surface of the cover 103.
申请公布号 US7825423(B2) 申请公布日期 2010.11.02
申请号 US20070700761 申请日期 2007.02.01
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 SHIRAISHI AKINORI;TAGUCHI YUICHI;SUNOHARA MASAHIRO;SAKAGUCHI HIDEAKI;KOIZUMI NAOYUKI;MURAYAMA KEI;HIGASHI MITSUTOSHI
分类号 H01L29/22;H01L33/44;H01L29/24;H01L33/60;H01L33/62 主分类号 H01L29/22
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