发明名称 |
Lift-off process for GaN films formed on SiC substrates and devices fabricated using the method |
摘要 |
One embodiment of a method according to the present invention for fabricating a high light extraction photonic device comprises growing a lift-off layer on a substrate and growing an epitaxial semiconductor device structure on the lift-off layer such that the lift-off layer is sandwiched between said device structure and substrate. The epitaxial semiconductor structure comprises an emitter adapted to emit light in response to a bias. The device structure, lift-off layer and substrate is flip-chip mounted on a submount such that the epitaxial semiconductor device structure is sandwiched between the submount and lift-off layer. The lift-off layer is removed to separate the substrate from the device structure. Different removal methods can be used such as removal by a photo electrochemical etch or by illuminating the lift-off layer with laser light.
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申请公布号 |
US7825006(B2) |
申请公布日期 |
2010.11.02 |
申请号 |
US20040841016 |
申请日期 |
2004.05.06 |
申请人 |
CREE, INC. |
发明人 |
NAKAMURA SHUJI;DENBAARS STEVEN |
分类号 |
H01L21/30;H01L21/00;H01L33/00;H01L33/10;H01L33/46 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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