发明名称 METHOD FOR ELECTROCONDUCTIVE PATTERN FORMATION
摘要 <p>A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass% of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a') forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b') treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, these steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass% of an inorganic alkaline compound.</p>
申请公布号 KR20100116585(A) 申请公布日期 2010.11.01
申请号 KR20107015865 申请日期 2009.01.22
申请人 MITSUBISHI PAPER MILLS LTD. 发明人 IRISAWA MUNETOSHI;TOYODA YUJI;KANEDA YASUO;NAKAGAWA KUNIHIRO
分类号 H05K3/06;G03F7/004;G03F7/38 主分类号 H05K3/06
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