| 摘要 |
<p>PURPOSE: A chip package assembly adopting a metal cap and a manufacturing method thereof are provided to allow no additional process for electromagnetic interference shield by using a metal cap covering a chip instead of a molding cover and packing the chip. CONSTITUTION: A metal cap having an internal cavity is arranged at an align jig(S110). The metal cap is settled in a plurality of mounting grooves which is formed in the upper side of the align jig in order to correspond to the shape of the metal cap. An insulating filler is filled in the internal cavity of the metal cap(S120). The chip is combined sot that the internal cavity of the metal cap covers the chip(S130). The filler is heated up and hardened(S140), and the substrate in which filler hardens is separated(S150).</p> |
