发明名称 METHOD FOR FABRICATING HIGHLY CONDUCTIVE FINE PATTERNS USING SELF-PATTERNED CONDUCTORS AND PLATING
摘要 <p>PURPOSE: A method for forming a high conductive fine pattern using a conductive pattern and plating is provided to reduce electric resistance of an electrode by plating metal materials on the conductive pattern. CONSTITUTION: Polymer materials(20) are laminated on a substrate(10). A depression(30) is formed to partially expose the substrate by removing the part of polymer materials. Conductive ink(40) is laminated on a mask template. Metal materials are laminated on a conductive pattern(41).</p>
申请公布号 KR100991105(B1) 申请公布日期 2010.11.01
申请号 KR20090101313 申请日期 2009.10.23
申请人 KOREA INSTITUTE OF MACHINERY & MATERIALS 发明人 SHIN, DONG YOUN;KIM, IN YOUNG
分类号 H01L21/027 主分类号 H01L21/027
代理机构 代理人
主权项
地址