发明名称 |
METHOD FOR FABRICATING HIGHLY CONDUCTIVE FINE PATTERNS USING SELF-PATTERNED CONDUCTORS AND PLATING |
摘要 |
<p>PURPOSE: A method for forming a high conductive fine pattern using a conductive pattern and plating is provided to reduce electric resistance of an electrode by plating metal materials on the conductive pattern. CONSTITUTION: Polymer materials(20) are laminated on a substrate(10). A depression(30) is formed to partially expose the substrate by removing the part of polymer materials. Conductive ink(40) is laminated on a mask template. Metal materials are laminated on a conductive pattern(41).</p> |
申请公布号 |
KR100991105(B1) |
申请公布日期 |
2010.11.01 |
申请号 |
KR20090101313 |
申请日期 |
2009.10.23 |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
SHIN, DONG YOUN;KIM, IN YOUNG |
分类号 |
H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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