METHOD OF MANUFACTURING SOI SUBSTRATE

摘要

PURPOSE: A SOI substrate manufacturing method is provided to improve a property of a manufactured SOI substrate by forming a recycled bond substrate which has reduced oxygen defects and impurity elements. CONSTITUTION: A first process forms an embrittled area on a bond substrate by irradiating ions on a bond substrate(110). A second process combines the bond substrate with an insulating layer(114) in-between. The bond substrate is divided on the embrittled area. A semiconductor layer(116) is formed on the bond substrate with the insulation layer in-between.