| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a high frequency module which performs vapor barrier masking in a desired area while using a recyclable member without requiring long-time manual work. SOLUTION: A method of manufacturing a high frequency module includes the steps of: placing an electronic component on a substrate 1 with which a high frequency circuit is formed on one side and a ground conductor pattern of the high frequency circuit is included on another side; placing a hard member 42, with which an elastic member 43 having a predetermined thickness is pasted on a side of the substrate 1, on both the sides of the substrate 1; compressing the elastic member 43 while holding the substrate 1 from both the sides with the hard member 42 so as to bring the high frequency circuit and the ground conductor pattern into tight contact with the elastic member 43; coating the substrate 1 with the vapor barrier; removing the hard member 42 after coating with the vapor barrier; and abutting a conductive casing 11 to the ground conductor pattern. The vapor barrier is selectively deposited on the substrate 1 excepting for the area in tight contact with the soft member 43, and the ground conductor pattern and the casing 11 are conducted for high frequency grounding. COPYRIGHT: (C)2011,JPO&INPIT
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