发明名称 METHOD OF MEASURING SURFACE ROUGHNESS OF COPPER TAPE AND METHOD OF MANUFACTURING COPPER-CLAD ALUMINUM WIRE USING THE SAME METHOD OF MEASURING
摘要 PROBLEM TO BE SOLVED: To correct the surface roughness of a copper tape to a predetermined value timely by grasping the surface roughness of the travelling copper tape in real time, to prevent the peeling of the copper layer due to defective adhesion by grasping an adhesion level between the cooper tape and an aluminum wire and to improve the productivity of a copper-clad aluminum wire by preventing the breaking of the wire during drawing by raising the wire speed in the tube-making stage. SOLUTION: In a stage where the composite wire of the copper-clad aluminum wire for manufacturing the copper-clad aluminum wire in which the copper is cladded on the outer periphery of a main conductor is manufactured by using pure aluminum or an aluminum alloy as the main conductor, the surface temperature of the copper tape is measured after grinding the copper tape and the amount of indentation of a grinding brush is adjusted on the basis of the surface temperature of the copper tape after grinding. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010240693(A) 申请公布日期 2010.10.28
申请号 JP20090092585 申请日期 2009.04.07
申请人 FUJIKURA LTD 发明人 KAWAKAMI AKIO;DAIHO MASANORI;KATAYAMA SHINJI;HATANAKA TASUKU;TODA YASUYUKI
分类号 B21C37/04;B21B45/06 主分类号 B21C37/04
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