发明名称 |
Sensor module |
摘要 |
A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate.
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申请公布号 |
US2010271787(A1) |
申请公布日期 |
2010.10.28 |
申请号 |
US20100661788 |
申请日期 |
2010.03.23 |
申请人 |
HOLZMANN MARTIN;OHL CHRISTIAN;EMMERICH HARALD |
发明人 |
HOLZMANN MARTIN;OHL CHRISTIAN;EMMERICH HARALD |
分类号 |
H05K7/02;H01L23/48;H01L29/84 |
主分类号 |
H05K7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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