| 摘要 |
A system for handling wafers comprising: at least one unload station; at least one intermediate station designed to hold the wafers at an angle; a processing station; and a transfer device configured to move the wafers between the stations. The intermediate station may be configured to receive the wafers in a back-to-back arrangement. An apparatus for handling wafers comprising: on one side, a vacuum gripper configured to grip individual wafers; and, on the other side, a gravity gripper configured to support one or more wafers when positioned beneath the wafers and lifted. A method for handling wafers, comprising: unloading wafers; transferring the wafers to an intermediate station; transferring the wafers from the intermediate station to a processing station; treating the wafers; unloading the wafers from the processing station; and reloading the wafers in a carrier, wherein the wafers are unloaded, transferred and reloaded by a transfer device. |
