| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminate having high surface planarity by suppressing the undulation exhibited by influence of sputtering. <P>SOLUTION: In the method of manufacturing laminate, an oxide dielectric film and/or a metallic film is deposited on at least one surface of a long-size resin film substrate F according to a sputtering method, and the laminate provided by depositing the film on the long-size resin film substrate F is pressed from a substantially normal direction for the surface of the laminate against the surface of the laminate at an environmental temperature in the range of the glass transition temperature of the long-size resin film substrate F minus 60°C and the glass transition temperature of the long-size resin film substrate F minus 20°C under a pressure of 98,000 Pa to 981,000 Pa. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
