| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductive paste material for restraining reduction of adhesive strength among particles forming a filler by thermal shocks. <P>SOLUTION: In the conductive paste material 4 having a base resin 5 and Cu particles 6 as a filler 8, an object wherein a Sn coating layer 7 is formed on the surface of Cu particle 6 is used as filler 8. Connecting conditions of particles are improved by making whiskers 10 growing from the Sn coating layer 7 of adjoining Cu particles 6 intertwine with each other, and separation of particles is prevented in the thermal shock. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
