| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate filling by enhancing fluidity in filling with an underfill resin after mounting electronic components, suppress the generation of voids, achieve a dam structure which can prevent the resin from flowing out to unnecessary regions, and easily form the dam structure without requiring additional processes therefor and costs associated therewith. <P>SOLUTION: After forming an insulating layer 17A in such a manner as to cover an outermost wiring layer 15 (conductor layer 16) formed on the mounting surface side of an electronic component, a mask R2 which is patterned into a required shape is used. The exposed part of the insulating layer 17A is removed stepwise, until the surface of a pad P1 defined by a part of the wiring layer 15 is exposed. Then, a recessed part DP1 is formed. <P>COPYRIGHT: (C)2011,JPO&INPIT |
