MOUNTING STRUCTURE AND MOUNTING METHOD OF MOLD PACKAGE

摘要

PROBLEM TO BE SOLVED: To improve heat releasing properties by increasing a heat dissipation path where a semiconductor chip directly comes into contact with a heat conductive member and is thermally connected in a mounting structure in which the mold package of a half-mold structure in which the other face of the semiconductor chip is directly exposed from molding resin is mounted on the heat releasing member via the heat conductive member.

SOLUTION: Side faces 13 located at the outer peripheral end portions of both plate faces 11 and 12 of the semiconductor chip 10 are exposed from the mold resin 20. A thermally conductive member 3 is disposed so as to wrap around from the other face 12 of the semiconductor chip 10 to the side face 13 and directly comes into contact with the other face 12 and the side face 13. The other face 12 and the side face 13 of the semiconductor chip 10 and a heat releasing member 2 are thermally connected via the thermally conductive member 3.

COPYRIGHT: (C)2011,JPO&INPIT